Smart card contactless controller modules

We offer field-proven, plug and play packaging technology for high-performing contactless smart cards

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Overview

Our contactless packages meet all the security and robustness requirements for smart cards. The module portfolio ranges from standard mold modules to innovative coil on module (CoM) contactless solutions in FCOS™ technology.

Key Features

  • High reliability and robustness
  • Up to 10 years' lifetime
  • Ultra-thin module for thin inlays
  • Proven technology

Products

About

Coil on module for contactless

Our innovative coil on module (CoM) contactless technology gives customers a unique way of integrating a chip into their products. Conventional chip packages are welded, soldered, or glued to the card antenna. With the CoM contactless package, however, the chip module communicates with the card antenna by radio frequency (RF). This eliminates the need for a complex mechanical design, making the card more robust and reducing production costs. The ultra-thin package (only 125 µm) also enables very thin inlays (200 µm).

Our products come with a broad spectrum of services

We complement our chips and modules with a variety of services. To support antenna design, for example, our experts are happy to provide reference designs or customer-specific designs. In addition, we offer services for radio frequency (RF) verification and testing, as well as reliability testing and failure analysis for cards.

Standard contactless smart card mold modules

Our standard smart card mold modules for contactless applications are a cost-effective solution supporting seamless integration. With a height of 250 µm and 340 µm, they are very thin and also meet the international standard specifications of other chip manufacturers.

Proven in the field in vast numbers

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Coil on module for contactless

Our innovative coil on module (CoM) contactless technology gives customers a unique way of integrating a chip into their products. Conventional chip packages are welded, soldered, or glued to the card antenna. With the CoM contactless package, however, the chip module communicates with the card antenna by radio frequency (RF). This eliminates the need for a complex mechanical design, making the card more robust and reducing production costs. The ultra-thin package (only 125 µm) also enables very thin inlays (200 µm).

Our products come with a broad spectrum of services

We complement our chips and modules with a variety of services. To support antenna design, for example, our experts are happy to provide reference designs or customer-specific designs. In addition, we offer services for radio frequency (RF) verification and testing, as well as reliability testing and failure analysis for cards.

Standard contactless smart card mold modules

Our standard smart card mold modules for contactless applications are a cost-effective solution supporting seamless integration. With a height of 250 µm and 340 µm, they are very thin and also meet the international standard specifications of other chip manufacturers.

Proven in the field in vast numbers

Billions of our modules and packages are deployed by customers who demand the highest quality standards.

Design resources

Developer community

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