NewSpace memory portfolio

Radiation tolerant memories

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Overview

More economic satellite launches translate to greater connectivity to enable access to the remotest areas of the world. The shift of market requirements to lower mission life and the unprecedented number of satellites for the LEO constellation drives the NewSpace market to be cost-conscious. Infineon's radiation-tolerant memories enables a right-sized mix of performance and reliability based on size, weight, power, and cost considerations.

Key Features

  • Radiation tolerant
  • Guaranteed TID radiation performance
  • Single lot date code
  • 100% electrical testing

Products

About

As the demand for global, ubiquitous connectivity continues growing, the combination of IoT and low Earth orbit (LEO) satellite constellations play an increasingly important role in creating a more connected and efficient world. A key driver behind the increasing popularity of LEO satellite constellations is the reduction in launch and operation costs for these smaller, lighter satellites. Mission life, radiation, and cost requirements are typically lower.

Infineon’s radiation tolerant memory enables a right-sized mix of performance and reliability based on size, weight, power, and cost (SWaP-c) considerations. Our technology experts have decades of experience in automotive and space electronics resulting in an LEO memory portfolio that is rad-tolerant by design for vital support functions of LEO satellite bus platforms and payload operations.

Infineon understands the importance of semiconductor product longevity and supply continuity, especially in high-reliability applications.

Infineon's RAM memory products longevity program supports select memory products for a minimum of ten years. Applicable products include asynchronous SRAMs, serial ferroelectric RAMs or F-RAMs, parallel non-volatile SRAMs or nvSRAMs, HYPERBUS™ interface-enabled serial HYPERRAM™ memories, as well as the RAM memories sold into aerospace, military, and defense markets. 

Through Infineon’s IR HiRel subsidiary, extension of product life or support services are available to help customers manage component end-of-life (EOL) of Infineon COTS and automotive power components that may be used in high-reliability electronic designs in space, avionics, defense, medical, and more. Our die and wafer bank services ensure supply longevity, mitigating obsolescence-induced support issues, and requalification costs.

Contact Infineon's HiRel sales to learn more.

Infineon works with chipset partners worldwide to qualify our memories, validate drivers and software, and develop turnkey reference designs. The result is a suite of tools and resources that simplify the design process and reduce the time to market. To help you select recommended and qualified memory for your chipset, Infineon publishes chipset pairing guides. These spreadsheets map which Infineon memory products have been qualified with which partner chipsets.

As the demand for global, ubiquitous connectivity continues growing, the combination of IoT and low Earth orbit (LEO) satellite constellations play an increasingly important role in creating a more connected and efficient world. A key driver behind the increasing popularity of LEO satellite constellations is the reduction in launch and operation costs for these smaller, lighter satellites. Mission life, radiation, and cost requirements are typically lower.

Infineon’s radiation tolerant memory enables a right-sized mix of performance and reliability based on size, weight, power, and cost (SWaP-c) considerations. Our technology experts have decades of experience in automotive and space electronics resulting in an LEO memory portfolio that is rad-tolerant by design for vital support functions of LEO satellite bus platforms and payload operations.

Infineon understands the importance of semiconductor product longevity and supply continuity, especially in high-reliability applications.

Infineon's RAM memory products longevity program supports select memory products for a minimum of ten years. Applicable products include asynchronous SRAMs, serial ferroelectric RAMs or F-RAMs, parallel non-volatile SRAMs or nvSRAMs, HYPERBUS™ interface-enabled serial HYPERRAM™ memories, as well as the RAM memories sold into aerospace, military, and defense markets. 

Through Infineon’s IR HiRel subsidiary, extension of product life or support services are available to help customers manage component end-of-life (EOL) of Infineon COTS and automotive power components that may be used in high-reliability electronic designs in space, avionics, defense, medical, and more. Our die and wafer bank services ensure supply longevity, mitigating obsolescence-induced support issues, and requalification costs.

Contact Infineon's HiRel sales to learn more.

Infineon works with chipset partners worldwide to qualify our memories, validate drivers and software, and develop turnkey reference designs. The result is a suite of tools and resources that simplify the design process and reduce the time to market. To help you select recommended and qualified memory for your chipset, Infineon publishes chipset pairing guides. These spreadsheets map which Infineon memory products have been qualified with which partner chipsets.

Documents

Design resources

Developer community

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